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Analyzer Shows Live RF
Tektronix’s SA2600 real-time spectrum analyzer uses DPX waveform image processor technology to show a live RF view of a spectrum in analog and digital transmissions.
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Boxes Feature Dual-Channel Gasket Construction
Bud Industries’ ANS Series die-cast NEMA boxes feature a dual-channel gasket that is made with a one-piece molded outer silicone gasket and a wire-mesh with sponge rubber.
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Fuses Fit for Electrical Ballasts
Littelfuse’s 208/209 Series 350-V 2AG-size fuses are designed for electrical ballasts used in fluorescent lighting and other applications.
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GPU Delivers up to 1G Pixels per Second
ARM’s Mali-400 MP scalable multiprocessor graphics processing unit (GPU) delivers up to 1G pixels per second in from one to four processors.
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ICs Provide Four Output Voltages
Micrel’s MIC2811/21 power management ICs provide four output voltages for system core, I/O, SDRAM, NAND flash, and Secure Digital (SDIO) with LDO regulators and a DC/DC converter.
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Microwave Amplifiers Use RF Technology
Cree’s CMPA0060005 and CMPA2560025 GaN monolithic microwave IC (MMIC) amplifiers use RF technology to form fully integrated amplifier circuits that replicate on a single silicon carbide (SiC) substrate.
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Oscilloscopes Operate From 1.5 to 6 GHz on Four Channels
LeCroy’s 700Zi Series WavePro digital oscilloscopes provide 1 M? and 50 ? input capability in bandwidths from 1.5 to 6 GHz on four channels with ?4 volt offset capability and ?3 volt common mode control.
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Sensor Supports Mobile Display Digital Interface
OmniVision Technologies’ OV3647 0.25" 3 MegaPixel image sensor supports the mobile display digital interface (MDDI) that operates at 15 fps in QXGA (2048 × 1536) resolution.
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2.5 V HCMOS Oscillators SignificantlyReduce Noise Levels
Fox Electronics now offers its HCMOS XpressO oscillators with 2.5 V operation. Featuring a third order Delta Sigma Modulator (DSM) that offers significantly reduced noise levels, the oscillators are comparable to traditional bulk quartz and surface acoustic wave (SAW) oscillators at a lower cost.
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Broadband Wireless Chipset Provides Seamless Migration
Odyssey™ 8500 delivers, flexibility, performance, footprint and power consumption tailored for handsets and handheld devices.
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Design Tools Help Meet Critical Power Budgets
With ChipVision's PowerOpt™ and P-SAM, users can evaluate performance, area and power tradeoffs at the architectural level rather than the gate level, resulting in significant savings.
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Ethernet Circular Connector with RJF Range
Amphenol Socapex has released a robust Ethernet circular connector with the RJF range.
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Membrane Media Increases Thermal Performance
W. L. Gore & Associates, Inc. introduces a membrane media for its line of GORE®Cooling Filters that increases thermal performance while providing strong environmental protection and reliability.
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New Process Delivers Significant Miniaturization
Avago Technologies announces a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels.
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Wire-wound Performance with Multi-layer Manufacturability
The BRC1608 series of high-current, wire-wound power inductors from Taiyo Yuden measure 1.6(L) x 0.8(W) x 0.8(H) mm (all dimensions ± 0.2 mm).
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WVAN Wireless Library Helps Prevent Wafer Spins
Agilent Technologies+IBk- Wireless Video Area Networks (WVAN) Library helps prevent unnecessary wafer spins, thus accelerating deployment of next-generation 60 GHz WVAN for high-volume consumer video equipment.
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